Surface Mount Technology Materials, Processes, and Equipment
نویسندگان
چکیده
منابع مشابه
Surface Mount Technology Market Forecasting
Most education tracts in Industrial Technology prepare students with traditional content relevant to industry. Learning these skills is critical to a student’s ability to function in any industrial field and these skills have always dominated industrial education. Within recent years, however, new computer technology is rapidly changing the face of industry. This comes in many forms, one of whi...
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Solder paste masks or stenc.ils are an integral part of the manufacturing process for surface mount circuit boards. This study will examine the feasibility of developing a process for rapidly ' Currently at IUA-Tencor Corporation, San Jose, CA 0-7803-6482-1 /OO/$lO.OO 02000 IEEE 2000 IEEWCPMT Int'l Electronics Manufactluring Technology Symposium
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We review the evolution and current status of robotic equipment and technology in urology. We also describe future developments in the key areas of virtual reality simulation, mechatronics and nanorobotics. The history of robotic technology is reviewed and put into the context of current systems. Experts in the associated fields of nanorobotics, mechatronics and virtual reality simulation simul...
متن کاملMounting of Surface Mount Components
Over the past few year, electronic products, and especially those which fall within the category of Consumer Electronics, have been significantly reduced in physical size and weight. Products such as cellular telephones, lap-top computers, pagers, camcorders, etc., have been reduced by as much as 3/4 of their original introductory size and weight. The most significant contributing factor to thi...
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Simple equations are derived to carry out degree of freedom analyses quickly and almost mechanically, using easily countable physical entities. It is shown that the outlet stream freedom does not depend on the number of component substances, and in many cases not on the number of phases. The concept of phase constraint is introduced to facilitate the degree of freedom analysis.
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ژورنال
عنوان ژورنال: Journal of Electronic Packaging
سال: 1991
ISSN: 1043-7398,1528-9044
DOI: 10.1115/1.2905388